Backend Service

Our full turnkey service provides the hassle-free operation from wafer out, through wafer sorting, grinding, packaging and finally deliver packaged units to your end-customers. Our wide range of specialty backend service includes:

  • Wafer Probing and IC Testing
  • Discrete Schottky Diode and MOSFET Testing
  • Test Program Development and Conversion
  • DUT/Probe Card Assembly and Repairing
  • Proprietary Tester Development and Manufacturing
  • IC Burn-in and Reliability Test
  • Wafer Back Grinding and Back Metal (BGBM)
  • Chip-on-Board (COB), Die Bonding, Wire Bonding, and Packaging
  • MPW wafer manual probing and characterization
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